Aluminum source ABN BF CL & CN
Cold lip and cold neck cells
Details
- Dedicated to Al material evaporation
- Enhance a cold lip effect & eliminates damages from Al creep
- Avoid specific damages with cold neck crucible for nitrogen atmosphere
- Uniformities better than ±1 %
Presentation
Riber Aluminum cells are designed specifically for Group III evaporation materials but mainly Aluminum. For S40 and S63 cells, the Aluminum cells are single zone, double zone for larger cells (see ABN DF section).
A Cold Lip Cell (CL) contains a single heater located at the bottom of the crucible, which accentuates the thermal gradient between the bottom and the top of the crucible, the top being cooler than the charge. For larger cells, a double zone (DZ) heater is used (ABN DF series). The negative thermal gradient is generated by balancing the power between the bottom and the top.
For application under nitrogen atmosphere obtained from ammonia (NH3) or high deposition rate plasma, we recommend using the Cold Neck assembly to enhance the cold lip effect of the cell. Here, an extra insert is added into the crucible (CN crucible). This configuration brings significant advantages, such as protecting the cell from damages due to aluminum creep and overflow.
Hence the Aluminum charge capacity is increased by a factor of four compared to standard effusion sources.
1 Day
4 Days
8 Days
12 DaysCold Neck technology – no overflow, no Al creeping after 12 days of use
The Cold Neck is mainly used for the growth of GaN with NH3 or when high rate deposition are required.
Layout
Technical information
| Cell characteristics | ABN 135 BF | ABN 60/80 BF | ABN 700 CN |
|---|---|---|---|
| Source capacity | 35 cc | 60/80 cc | 700 cc |
| Mounting flange | CF35 | CF63 | CF150 |
| Temperature stability | ±0,2°C | ||
| Crucible shape | Conical | ||
| Crucible material | PBN | ||
| Filament | One – Bottom | One – Bottom | Two-Top & bottom |
| Filament type | Tantalum filament | ||
| Thermocouple type | C-type | ||
| Typical operating temperature | 750 –1350°C | ||
| Maximum outgassing temperature | 1400 °C | 1400°C | Bottom filament 1400 °C / Top filament 1300°C |
| Power required for maximum temperature* (top + bottom filaments simutaneously) |
350 W | 750 W | 3460 W |
| Power supply | One power supply / One temperature controller | One power supply / One temperature controller | Two power supplies / Two temperature controllers |
| Cold Neck version available | Yes | Yes | Yes |
*For some versions and systems adaptations, integrated water cooling can be available
Component interfacing
